Ic Fabrication Technology [Paperback]

Title
Contents
1. Overview of Metal-Oxide-Semiconductor (MOS) Transistor
	1.1 Introduction
	1.2 Moore’s Law
	1.3 Future Sizes of a Transistor and a Chip
	1.4 Physics of Silicon
	1.5 Silicon Devices
	1.6 MOS Transistor
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
2. Silicon Wafer Preparation for MOS Transistor Fabrication
	2.1 Introduction
	2.2 Silicon Crystal Structure
	2.3 Defects in a Silicon Crystal
	2.4 Single Crystalline Silicon-Wafer Fabrication for MOS Transistor Applications
	2.5 Fabrication of Silicon Wafer from the Boule
	2.6 Specifications of the Silicon Wafer
	2.7 Defects and Impurities in the Silicon Wafer
	2.8 Wafer Contaminations
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
3. MOS Transistor Process Flow
	3.1 Introduction
	3.2 MOS Transistor Fabrication
	3.3 Device Isolation
	3.4 CMOS Fabrication
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
4. Oxidation
	4.1 Introduction
	4.2 Structure of Silicon Dioxide
	4.3 Oxidation Equipment and Process
	4.4 Kinetics of Oxidation
	4.5 Comment on the Deal-and-Grove Oxidation Model
	4.6 Oxide Charges
	4.7 Silicon Oxide Characterisation
	4.8 Electrical Characterisation of MOS Capacitance
	4.9 Case I: Non-Ideal Case
	4.10 Case II: Ideal Case
	4.11 Procedure of Oxide and Oxide/Silicon Interface Charge Measurements
	4.12 Oxide Breakdown Measurements
	4.13 Other Silicon Oxidation Techniques
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
5. Mask
	5.1 Introduction
	5.2 Properties of Masks
	5.3 Types of Masks and Mask Fabrication Techniques
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
6. Lithography
	6.1 Introduction
	6.2 Photolithography Process
	6.3 Photoresist
	6.4 Non-Photoresist (Resist)
	6.5 PR Cleaning Procedure
	6.6 Light Source and the Optical Exposure System
	6.7 Pattern Transferring Techniques and Mask Aligner
	6.8 Optical Projection Lithography Technique
	6.9 Non-Optical Projection Lithography Technique
	6.10 Ion-Beam Lithography
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
7. Etching
	7.1 Introduction
	7.2 Etching Techniques
	7.3 Wet Etching of Common Films
	7.4 Plasma Etching (Dry Etching)
	7.5 Plasma Etching Mechanisms and Etching Modes
	7.6 Plasma Etching Parameters
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
8. Diffusion
	8.1 Introduction
	8.2 Diffusion Equipment and Process
	8.3 Diffusion Models
	8.4 Modification of Fick’s Law
	8.5 Oxidation Effects on Diffusion
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
9. Ion-Implantation
	9.1 Introduction
	9.2 Ion-Implantation Equipment
	9.3 Ion-Implantation Parameters
	9.4 Parameters Affecting the Dose and Uniformity
	9.5 Advantages of Ion-Implantation
	9.6 Disadvantages of Ion-Implantation
	9.7 Ion-Implantation Model
	9.8 Ion Stopping
	9.9 Ion Channelling
	9.10 Annealing
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
10. Thin Film Deposition
	10.1 Introduction
	10.2 Film-Deposition Techniques
	10.3 Metal Wirings and Contacts
	10.4 Metal Film Deposition Techniques
	10.5 Metal Alloy Deposition
	10.6 Nitride Deposition
	10.7 Silicide Deposition
	10.8 Dielectric Deposition
	10.9 Silicon Deposition
	10.10 Film Thickness Measurements
	Summary
	References
	Multiple-Choice Questions
	Descriptive Problems
11. ULSI (nano) Fabrication
	11.1 Introduction
	11.2 Dielectric Film Deposition
	11.3 Lithography
	11.4 Etching
	Summary
	References
Index